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ARS Home » Southeast Area » New Orleans, Louisiana » Southern Regional Research Center » Commodity Utilization Research » Research » Publications at this Location » Publication #336078
Research Project: Increasing the Value of Cottonseed

Location: Commodity Utilization Research

Title: Adhesive strength of pilot-scale washed cottonseed meal in comparison with a synthetic adhesive for non-structural application

Author
item He, Zhongqi
item CHIOZZA, FABIO - Vinavil Spa

Submitted to: Meeting Proceedings
Publication Type: Proceedings
Publication Acceptance Date: 1/3/2017
Publication Date: 5/1/2017
Citation: He, Z., Chiozza, F. 2017. Adhesive strength of pilot-scale washed cottonseed meal in comparison with a synthetic adhesive for non-structural application. In: Proceedings for the 2017 Beltwide Cotton Conference, January 4-6, 2017, Dallas, Texas. pp. 904-907.

Interpretive Summary: Great progress has been made on developing bio-based wood adhesives from renewable natural resources over last couple of decades . Water-washed cottonseed meal (WCSM) showed the adhesive performance comparable to cottonseed protein isolate. To promote WCSM as an industrial wood adhesive for non-structural application, in this work, we tested the WCSM's adhesive performance in reference to the relevant industrial standards. The results were further compared with an industrial synthetic adhesive. The information presented in this work would be helpful in formulating industrial-applicable WCSM-based wood adhesives.

Technical Abstract: Great progress has been made on developing bio-based wood adhesives from renewable natural resources over last couple of decades . Water-washed cottonseed meal (WCSM) showed the adhesive performance comparable to cottonseed protein isolate. To promote WCSM as an industrial wood adhesive for non-structural application, in this work, we tested the WCSM's adhesive performance in reference to the relevant industrial standards. The results were further compared with an industrial synthetic adhesive. The information presented in this work would be helpful in formulating industrial-applicable WCSM-based wood adhesives.